Zak Mir talks to Ian Lankshear, CEO of EnSilica, about the leading fabless microchipmaker, which has announced that it has entered into two landmark development contracts with a leading European satellite operator to develop two chips for its next-generation satellite network. 

EnSilica has been a listed company for 4 years, and after a period of steady groundwork, the business now appears to be entering a far more commercially significant phase. The key reason is simple: space communications is no longer a futuristic sideshow. It is becoming strategic infrastructure, and specialist chip design sits right at its heart.

That shift was underscored by EnSilica’s recent announcement that it has secured two landmark development contracts with a leading European satellite operator. The work covers two chips for a next-generation satellite network: one for the satellite's payload and one for the user terminal on the ground.

For a fabless semiconductor company, that is not just another contract win. It is the kind of milestone that can validate years of technical investment and establish a company as a serious supplier into a rapidly expanding global market.

Why 2026 could be a turning point for EnSilica

After four years on the market, EnSilica is now seeing several strands come together at once. The company has spent years building capability in semiconductor design, particularly in communications and high-performance, low-power applications. What is changing now is that the market is finally demanding exactly the kind of technology it has been developing.

The standout development is in the space sector. EnSilica has previously announced smaller wins, feasibility studies and early-stage projects, including work with AST SpaceMobile. But this latest contract with a European satellite operator looks more substantial. It signals that EnSilica is no longer simply participating in the sector. It is beginning to establish itself as a meaningful supplier within it.

The commercial logic is compelling. Satellite systems need chips that are:


  • Extremely low power

  • Very high performance

  • Cost-efficient for large-scale deployment

  • Suitable for both space payloads and ground terminals

Those requirements are technically demanding, which is precisely why they can create attractive opportunities for specialist chip designers with the right expertise and intellectual property.

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